Summary
Global Custom Electronic Packaging Market Future Scope, Size, Analysis, Growth, Trends By
Material (Corrugated Boxes, Foamed Plastic, Paperboard, Bubble Packaging, Others), By Product
Size (Small Appliances, Large Appliances), By Technology (Authentication Packaging, Track
And Trace Packaging) And By Region - Global Forecast To 2023
Custom Electronic Packaging Market Scenario
Electronic goods packaging are fill materials used to protect, prevent damage, identify,
identification and prevent tampering of electronics goods. The global Custom Electronic
Packaging Market is anticipated to grow at a CAGR of around 5 % during the forecast period of
2017 to 2023.
The growth of the Custom Electronic Packaging Market is majorly driven by the boom in the e-
commerce retail industry. The shipment of electronic goods across huge distances is further driving
the need for effective packaging solutions. The proper packaging of electronic goods will ensure
that the products are protected from getting destroyed. Thus, this need for the protection of
products is further driving the growth of the Custom Electronic Packaging Market. The increase
in the production of various kinds of electronic devices is further contributing to the growth of the
Custom Electronic Packaging Market.
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Key Players
The key players of Custom Electronic Packaging Market are
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• DS Smith Plc. (U.K.)
International Paper Company (U.S.)
Mondi plc. (Austria)
Sealed Air Corporation (U.S.)
Smurfit Kappa (Republic of Ireland)
Dunapack Packaging (Austria)
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• Georgia-Pacific LLC (U.S.)
Graham Packaging (U.S.)
Pregis LLC (U.S.)
Sonoco Products Company (U.S.)
• Stora Enso (Finland) and others.
Market Segmentation
To generate a bird’s view of the global packaging foams market, the report is segmented by
material, product size, technology, and region.